Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3d integrated circuits

ABSTRACT

Roughly described, an integrated circuit device has a conductor extending entirely through the substrate, connected on one end to the substrate topside surface and on the other end to the substrate backside surface. In various embodiments the conductor is insulated from all RDL conductors on the backside of the substrate, and/or is insulated from all conductors and device features on any below-adjacent chip in a 3D integrated circuit structure. Methods of fabrication are also described.

CROSS-REFERENCE TO OTHER APPLICATIONS

This application is a Divisional of U.S. application Ser. No.13/601,394, filed 31 Aug. 2012, by Jamil Kawa and Victor Moroz, entitled“LATCH-UP SUPPRESSION AND SUBSTRATE NOISE COUPLING REDUCTION THROUGH ASUBSTRATE BACK-TIE FOR 3D INTEGRATED CIRCUITS,” Attorney Docket No. SYNP2070-1, which application is incorporated herein by reference in itsentirety.

BACKGROUND

The invention relates to 3D integrated circuits, and more particularlyto structures and methods for suppressing latch-up and noise coupling.

A typical CMOS circuit includes N- and P-type regions arranged to formplanar or multi-gate MOS transistors. Regions of opposite conductivitytypes which are adjacent each other typically form parasitic pnjunctions and bipolar transistor structures. While usuallyreverse-biased, conditions can occur in which these structures becomeforward biased. When this occurs, a positive feedback loop ensues whichprovides a low resistance current path from the positive supply voltageto ground, thereby interfering with proper functioning of the circuitand, in serious cases, destroying the chip through heat damage.

FIG. 1 is a schematic diagram showing a typical CMOS arrangementincluding a PMOS transistor 110 adjacent to an NMOS transistor 112. Suchproximity is common in CMOS devices. The PMOS transistor 110 includestwo heavily doped P+ diffusion regions 116 and 118 separated laterallyby a channel region 120. A gate stack 122 overlies the channel region120. The two P+ diffusion regions 116 and 118 are formed inside anN-well 124, which is itself an N-doped region formed inside a lightlydoped P− substrate 114. Also formed within the N-well 124 is a heavilydoped N+ diffusion 125, also called a well tie or a contact pad, forconnecting the N-Well 124 to VDD.

The NMOS transistor 112 includes two heavily doped N+ type diffusionregions 126 and 128 separated laterally by a channel region 130. A gatestack 132 overlies the channel region 130. The two N+ diffusion regions126 and 128 are formed directly in the P− substrate 114. Also formed inthe substrate in close proximity to one of the N+ diffusion regions 126and 128, is a heavily doped P+ diffusion region 135, also called asubstrate tie or a contact pad, for connecting the P− substrate 114 toground.

Other CMOS arrangements are common as well, including those that alsoinclude a lightly doped P-well in which the NMOS transistor 112 isformed. The arrangement of FIG. 1 will be illustrative of the latch-upproblem, but it will be understood that many other arrangements alsosuffer from the same problem.

Superimposed on the CMOS diagram of FIG. 1 is a circuit schematicillustrating the bipolar transistors that are formed by the various PNjunctions formed by the CMOS arrangement. In particular, a PNPtransistor Q1 is formed by one of the P+ diffusions 116 or 118 acting asthe emitter E1, the N-well 124 acting as the base B1, and the P−substrate 114 acting as the collector C1. At the same time, the N-well124 acts as the collector C2 of an NPN transistor Q2, with the P−substrate 114 acting as the base B2, and one of the N+ regions 126 or128 acting as the emitter E2. The base B1 of the PNP transistor Q1 isconnected to the collector C2 of the NPN transistor Q2, and the base ofNPN transistor Q2 is connected to the collector C1 of PNP transistor Q1.The base B1 of transistor Q1 is connected to N+ diffusion 125 throughthe resistance Rw of the N-well 124, and the base B2 of transistor Q2 isconnected to P+ diffusion 135 through the substrate resistance Rs.

FIG. 2 is schematic circuit diagram of FIG. 1 rearranged to show itvertically. It can be seen that as long as the two bipolar transistorsQ1 and Q2 are not forward biased, current will not flow through thecircuit. A number of conditions can trigger latch-up however, includingnoise, which sometimes can induce sufficient current at the base of oneof the transistors for long enough to forward bias the other transistor,thereby starting a feedback loop. Several techniques have been devisedfor reducing or eliminating latch-up susceptibility, some of which arediscussed in Wolf, Silicon Processing for the VLSI Era, Vol. II, ProcessIntegration, pp. 400-419 (1990), incorporated herein by reference.

One common technique for reducing or eliminating latch-up susceptibilityis to connect the backside of the substrate to ground. Referring to FIG.1, if the substrate tie 135 is also connected to ground, it can be seenthat this technique provides a low resistance current path in parallelwith the substrate resistance Rs, effectively short circuiting it. Thebase B2 of NPN transistor Q2 therefore is effectively connected to itsemitter E2 and the transistor cannot conduct.

FIG. 3 (consisting of FIGS. 3A and 3B) illustrates how the shortcircuiting of Rs is often accomplished in a typical lead frame package.FIG. 3A is a cross-sectional view of the package showing a die 310, andFIG. 3B is an enlarged topside view of a corner 322 of the structure ofFIG. 3A. As shown in FIG. 3A, the die 310 is attached on its back sideusing an electrically conductive die attach adhesive 312, to a metallead frame pad 314. The lead frame also includes a number of metal leads316 that extend out through the epoxy molded packaging material 318 forexternal electrical connection. Some of the leads 316, for example lead316A, are connected to the lead frame pad 314 to ground externally ofthe package, and thereby connect the back side of the die 310 to ground.Others of the leads 316 are connected to various I/O and power pads (324in FIG. 3B) on the top side of the chip. In addition, FIG. 3B alsoillustrates that some of the bonding pads 324, for example 324A, areconnected (“down-bonded”) directly to the lead frame pad 314 usingcorresponding bonding wires 320A. These bonding pads 324A are formed onand connect to heavily doped P+ contact pads such as 135 (FIG. 1). Sinceas previously mentioned the backside of the die is also connected to thelead frame pad 314 through conductive die attach material 312, it can beseen that a very low resistance conductive path is formed electricallyconnecting the P+ contact pads 135 to the backside of the substrate die310, thereby short circuiting the substrate resistance Rs (FIG. 1). WithRs short circuited, it becomes much less likely that transient currentflow through PNP transistor Q1 can increase the base-collector voltageon NPN transistor Q2 sufficiently to turn it on. As a result, latch-upconditions are less likely.

Recently, as integrated circuit densities have increased, manufacturershave begun developing packaging structures in which two or more dies arestacked on top of each other. Signal and power supply lines from the topsurface of one chip are passed through the body of the chip to the onebelow using through-silicon vias (TSVs). A TSV is a conductive post thatextends all the way through the chip, from the topside surface to thebackside surface, where it can connect through metal bump contacts toconductors on the topside surface of the below-adjacent chip. Theconductor in the TSV is typically copper or another metal such as TiW,and it is typically isolated from the substrate along its entire lengthby a dielectric or other barrier material. On the topside, ordinarymetal interconnects connect the top ends of the TSV conductors tocircuit components. The backside surface of the chip is coated with aninsulator, such as an oxide, and holes are opened to expose the bottomends of the TSV conductors. One or more layers of metal interconnects(called RDL (redistribution layer) conductors) are formed on thebackside to electrically route signals and power from the bottom ends ofthe TSV conductors to the positions required for mating with theappropriate bump contacts on the below-adjacent chip. The bottom chip inthe stack is connected to external circuitry usually by TSVs connectedon the backside to a ball grid array (BGA). The overall stack of chipsis sometimes referred to herein as a three-dimensional integratedcircuit (3DIC).

3DIC technology poses a number of problems for known techniques forsuppressing latch-up. First, because of the difficulties in fabricatingvery deep TSVs, chip substrates used in 3DICs typically are considerablythinned, from the backside, to a thickness of only around 50 microns.Referring to FIG. 1, it can be seen that a much thinner substrateconsiderably narrows the current path through the substrate to the P+substrate contact pads 135, thereby significantly increasing thesubstrate resistance Rs. Moreover, down-bonding is no longer availableto short circuit this current path, since the substrate backside is notconnected by die attach adhesive to a below-adjacent lead frame pad.Thus Rs is not short circuited, and the potential for latch-upconditions is significantly higher. Second, in 3DIC's, it is common forTSVs to be used to carry power and signals through a particular chip,from the below-adjacent chip to the above-adjacent chip and vice-versa,without ever having to connect to the chip or chips stacked betweenthem. This is common where, for example, some chips are designed tooperate at 1 volt while the chips above and below are operating at 3.3volts. In this case the TSV might carry a 3.3 volt signal through a 1volt chip, which can easily induce sufficient currents by capacitivecoupling to trigger latch-up in the more sensitive 1 volt chip.

Accordingly, an opportunity arises to create robust solutions to theproblem of latch-up susceptibility in 3D integrated circuits. Betterchip yields, and denser, and more powerful circuits, components andsystems may result.

SUMMARY

Roughly described, an integrated circuit device has a conductorextending entirely through the substrate, connected on one end to thesubstrate topside surface and on the other end to the substrate backsidesurface. In various embodiments the conductor is insulated from all RDLconductors on the backside of the substrate, and/or is insulated fromall conductors and device features on any below-adjacent chip in a 3Dintegrated circuit structure.

The above summary of the invention is provided in order to provide abasic understanding of some aspects of the invention. This summary isnot intended to identify key or critical elements of the invention or todelineate the scope of the invention. Its sole purpose is to presentsome concepts of the invention in a simplified form as a prelude to themore detailed description that is presented later. Particular aspects ofthe invention are described in the claims, specification and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with respect to specific embodimentsthereof, and reference will be made to the drawings, in which:

FIG. 1 is a schematic diagram showing a typical CMOS structure incross-section. Bipolar parasitic transistor circuitry is superimposed onthe cross-section.

FIG. 2 is schematic circuit diagram of the bipolar circuitry of FIG. 1rearranged to show it vertically.

FIG. 3 consists of FIGS. 3A and 3B.

FIG. 3A a cross-sectional view of a package showing a die.

FIG. 3B is an enlarged topside view of a corner 322 of the structure ofFIG. 3A.

FIG. 4 is a cross-sectional view illustrating pertinent features of a 3Dintegrated circuit structure incorporating aspects of the invention.

FIG. 5 (consisting of FIGS. 5A through 5I) illustrates an exampleprocess flow that can be used to fabricate a 3D integrated circuit suchas that shown in FIG. 4.

FIG. 6 shows a simplified representation of an illustrative digitalintegrated circuit design flow incorporating features of the invention.

FIG. 7 is a simplified block diagram of a computer system 710 that canbe used to implement software incorporating aspects of the presentinvention.

DETAILED DESCRIPTION

The following description is presented to enable any person skilled inthe art to make and use the invention, and is provided in the context ofa particular application and its requirements. Various modifications tothe disclosed embodiments will be readily apparent to those skilled inthe art, and the general principles defined herein may be applied toother embodiments and applications without departing from the spirit andscope of the present invention. Thus, the present invention is notintended to be limited to the embodiments shown, but is to be accordedthe widest scope consistent with the principles and features disclosedherein.

FIG. 4 is a cross-sectional view illustrating pertinent features of a 3Dintegrated circuit structure 410 incorporating aspects of the invention.The drawing, as with all drawings herein, is not to scale. Only a smallpart of the structure is shown, and it will be understood that typicallyeach chip is much larger (laterally) and includes many more features.Additionally, FIG. 4 shows only two vertically-adjacent chips of the 3Dstructure 410: chip 412 and below-adjacent chip 414. A typical 3D ICmight include additional chips further above and/or below, all orientedparallel to each other in a fixed structure. Pertinent features of chip412 are described herein, and only some features of chip 414 aredescribed herein. It will be understood that chip 414 may be structuredsimilarly to chip 412 in some embodiments, but need not be.

Chip 412 includes a lightly doped P− substrate 416 on which all featuresare formed. As used herein, no distinction is made between the formationof features “in” or “on” a substrate, and both terms are usedinterchangeably herein. The chip 412, which is only about 50 micronsthick in the illustrated embodiment, includes an NMOS transistor 418 anda PMOS transistor 420. The NMOS transistor 418 includes two N+diffusions 422 and 424 separated laterally by a channel region 426. Agate stack 428 is formed above the channel region 426. The PMOStransistor 420 is formed within an N-well diffusion 430, and includestwo P+ diffusions 432 and 434 separated laterally by a channel region436. A gate stack 438 is formed above the channel region 436. The chipalso includes a heavily doped N+ contact pad 435 formed in N-well 430,as well as a heavily doped P+ contact pad 425 formed directly in the P−substrate 416.

In the illustration of FIG. 4 the chip 412 also includes twothrough-silicon vias (TSVs) 440 and 442. These vias extend entirelythrough the chip 416, from the topside surface 444 through the backsidesurface 446. As used herein, a “topside” surface and a “backside”surface are the two opposite major surfaces of the chip, and it will beunderstood that if the chip is turned upside down, the surface labeledthe topside surface remains the topside surface and the surface labeledthe backside surface remains the backside surface. In addition, theterms topside and backside also indicate directions relative to thewafer. That is, a layer said to be located “on the backside” of a waferneed not necessarily be disposed immediately adjacent to the backsidesurface, so long as it is disposed beyond the backside surface, in adirection away from the wafer body. For example, in the illustration ofFIG. 4 both the oxide layer 458 and the RDL conductor 464 each can bedescribed as being “on the backside” of the wafer, and the RDL conductor464 also can be described as being “on the backside” of the oxide layer458.

The TSVs 440 and 442 in FIG. 4 are filled with an electricallyconductive material such as copper or TiW to form conductors 450 and 451respectively, and lined with an insulating material such as SiO2 448 toisolate the conductors from the substrate. The topside surface 444 ofthe substrate 416, and above the gate stacks 428, 438, there is formed adielectric layer 452, made for example of an oxide. Vias (holes) areformed in the dielectric layer 452. The vias are filled with aconductive material 454, such as aluminum, and first metal layer M1conductors are formed on top. Note that whereas the illustration of FIG.4 shows only one metal layer M1, it will be appreciated that a typicalchip may also have several more metal layers formed above M1, eachisolated from the below-adjacent layer by a dielectric similar todielectric layer 452.

It can be seen in FIG. 4 that one of the M1 conductive segments iselectrically connected to the topside end of the TSV conductor 451through via 454C. Another one of the M1 conductive segments 456electrically connect the substrate topside end of the TSV conductor 450to the P+ contact pad 425, through respective vias 454A and 454B. Inanother embodiment, the connection of the substrate topside end of theTSV conductor 450 to the P+ contact pad 425 can be made in a differentmetal layer instead, or in some embodiments through a conductive pathtraversing more than one layer of metal.

On the backside surface 446 the chip 412 includes a dielectric layer 458(such as an oxide), and on the backside of the dielectric layer 458 areRDL (redistribution layer) conductors for routing power and signals todesired lateral positions for making contact with a below-adjacent chip.One RDL conductor 464 is shown, it being understood that typically thereare many more in addition. RDL 464 is connected to the backside-end ofTSV conductor 451 through conductive material in a via 462 passingthrough the dielectric layer 458. As is typical, the conductive materialin via 462 is considerably narrower than the conductor 451 in TSV 442,and at the backside surface 446 it makes electrical contact only withthe conductor 451.

It can also be seen in FIG. 4 that no RDL conductor is connected to thebackside end of TSV conductor 450. Instead, via 460 is offset relativeto the TSV 440 such that the conductive material 466 inside it makeselectrical contact with both the backside end of TSV conductor 450 andthe backside surface 446 of the substrate 416 itself. Because of thisconnection, as well as the connection on the topside of substrate 416through metal layer conductive segment 456, it can be seen that in thestructure of FIG. 4 the P+ contact pad 425 on the topside surface 444 isconnected to the backside surface 446 of the substrate 416, therebybypassing the substrate resistance Rs with a low resistance path andeffectively suppressing lockup conditions. More particularly, the TSVconductor 450 has a topside end connected to a point on the substrate416 topside surface 444, and has a backside end connected to a point onthe substrate 416 backside surface 446.

The TSV conductor 450 topside end is actually connected to an entiresurface region 427 on the substrate 416 topside surface 444, but as usedherein, that does not alter the fact that it is connected to at leastone point. Similarly, the TSV conductor backside end is actuallyconnected to an entire surface region 467 on the substrate 416 backsidesurface 446, but as used herein, that does not alter the fact that it isconnected to at least one such point. Also, whereas the portion of chip412 illustrated in FIG. 4 shows only one TSV conductor 450 that isconnected in this way, it will be appreciated that preferably a chipwould contain numerous such conductors, spread throughout the lateralarea of the chip.

The chip 414 of FIG. 4, as mentioned, is below-adjacent to the chip 412in the 3D IC 410. Chip 414 includes upper layer conductors 468 which areconnected to circuit or device features below through vias in variousdielectric layers. The upper layer conductors 468 are connected tocircuitry on the above-adjacent chip 412 by bump contacts such as 470.An electrically conductive path is formed from a device feature (notshown) on chip 414 to a device feature on chip 412 by conductors passingthrough vias on the topside of the substrate 472 of chip 414 and routedalong various metal layers, through bump contacts such as 470, along RDLconductive segments such as 464 on the backside of the above-adjacentchip 412, through vias such as 462 and TSV conductors such as 451 to thetopside of chip 412, and then through conductors passing through vias onthe topside of the substrate 416 and routed along metal layers to thedevice feature on the chip 412.

Below-adjacent chip 414 is mechanically attached to the chip 412 by anyof a variety of mechanisms, such as by dielectric adhesive, or by aseparate scaffolding structure, or even by the mechanical and adhesiveproperties of the bump contacts 470. Other mechanisms will be apparentto the reader.

The TSV conductor 450 is not connected to any (insulated from all)conductors and device features on the below-adjacent chip 414.Preferably but not essentially, this is accomplished by not connectingthe backside end of TSV conductor 450 to any RDL conductive segment(insulating the backside end of TSV conductor 450 from all RDLconductive segments). In the embodiment of FIG. 4, connection to any RDLconductive segment is avoided by not completely filling the via 460 withthe conductive material 466. The remaining depth of via 460 may befilled with a dielectric, or with passivation material, or air. In otherembodiments the conductive material 466 may fill via 460, in the sameway as does the conductive material in via 462, but any RDL material issimply etched in such a pattern that avoids the lateral position of TSV460. Many other mechanisms will be apparent to the reader for insulatingTSV conductor 450 from any device feature on the below-adjacent chip414.

FIG. 5 (consisting of FIGS. 5A through 5I) illustrates an exampleprocess flow that can be used to fabricate a 3D integrated circuit suchas 410. It will be understood that many of the steps can be combined,performed partially or completely simultaneously with other steps, orperformed in a different sequence without deviating from the invention.In some cases, as the reader will appreciate, a re-arrangement of stepswill achieve the same results only if certain other changes are made aswell. In other cases, as the reader will appreciate, a re-arrangement ofsteps will achieve the same results only if certain conditions aresatisfied. Furthermore, it will be appreciated that the fabrication flowdescribed herein mentions only steps that are pertinent to anunderstanding of the invention, and it will be understood that numerousadditional fabrication steps, well known to the reader, may be needed todevelop a working device.

Referring to FIG. 5A, initially, a lightly doped P-type wafer includingsubstrate 416 is provided. This wafer may be, for example, on the orderof 500 microns thick. Wafers typically are manufactured with the lightP-type doping throughout, and arrive that way to the chip maker. Afterdevices and interconnects are formed on a wafer the wafer is usuallysliced (“diced”) into individual dies, or chips. As used herein, theterms wafer and substrate are similar except that whereas “wafer” refersto the entire slice provided to the fab, “substrate” need not.“Substrate” applies equally well to an entire wafer or to a chip cutfrom the wafer.

Next, referring to FIG. 5B, N-well 430 is formed by known techniquessuch as ion implantation or dopant diffusion. Note that though thediffusion regions shown in the drawings are referred to herein as“diffusion” regions, it will be understood that this is only forconvenience and that in many embodiments they may actually be formed byother methods such as ion implantation.

After the N-well 430 is formed, the gate stacks 428 and 438 are formedby known techniques. Known self-aligned techniques are then used to formthe N+ diffusions 422 and 424 for NMOS transistor 418 and the P+diffusions 432 and 434 for PMOS transistor 420. The contact pads 425 and435 are also formed at this time. Next, trenches 540 and 542 are etchedinto the wafer, such as by forming and patterning a photoresist layer,and using the patterned photoresist as an etch mask for etching thetrenches. The photoresist can then be removed by, for example, a plasmaetch. The trenches 540 and 542 extend more than about 50 microns indepth, but do not pass through the entire substrate 416.

Next, the insulating material 448 is formed inside the trenches 540 and542 and lining the walls thereof. For example, SiO2 or anotherdielectric can be grown or deposited over the trench sidewalls. Otherinsulating materials can be used as well, as can a combination ofmaterials which together act as an insulator or dielectric.

Referring to FIG. 5C, the TSV trenches 540 and 542 are filled with aconductive material such as copper, to form TSV conductors 450 and 451.This step can be accomplished for example by depositing a thin film seedmetal layer on the inside surfaces of the trench sidewall material, andapplying the conductive material by electroplating. Next, oxide layer452 is formed by oxidation and vias such as 554 are etched in the oxideby applying and patterning a photoresist, then etching the oxide throughexposed regions of the photoresist.

Referring to FIG. 5D, the vias 554 are then filled for example withaluminum, to thereby form conductors 454A, 454B, as well as otherconductors 454. The M1 metal layer is then applied above the dielectriclayer 452 and patterned to form metal interconnects including conductivesegment 456. Conductive segment 456 completes the connection of thetopside end of TSV conductor 450 to the topside surface of the substrate416 at the contact pad 425. Other dielectric and conductive layers (notshown) are formed above the M1 layer.

Referring to FIG. 5E, after all the topside processing is complete, thewafer is ground from the backside until its thickness is reducedsufficiently to expose the backside ends of TSV conductors 450 and 451.The wafer is then inverted and backside processing begins. Referring toFIG. 5F, a dielectric layer such as oxide 458 is grown on the entirebackside surface 446 of the substrate 416. Referring to FIG. 5G, vias460 and 460 are formed in the oxide 458 by etching the oxide through apatterned photoresist. The via 462 is much narrower than the diameter ofTSV 542, and is roughly centered laterally across the backside end ofTSV conductor 451. The via 460, on the other hand, is either wider orlaterally offset from the center of the backside end of TSV 540, orboth, so that it exposes both the backside end of TSV conductor 450 andthe region 467 on the backside surface 446 of the substrate 416. Ifdesired to improve the connectivity to the substrate 416 backsidesurface, at this time an additional P+ contact pad (not shown) can beformed in the substrate 416 at region 467 by ion implantation throughthe backside vias. As used herein, an insulator such as 458 is said tohave an opening “exposing” a region even though the opening might befilled with another material, such as a conductor. The term does notnecessarily mean that the “exposed” region is visible through theopening. The term indicates that the “exposed” region is exposed atleast so far as the insulator is concerned.

Referring to FIG. 5H, a metal layer is applied to the backside of thedielectric layer 458, which also fills the vias 460 and 462. This metalmay be the same as that used to fill the TSVs 540 and 542. The metal 466in via 460 connects to both the backside end of TSV conductor 450 andthe region 467 on the backside surface 446 of the substrate 416. Aconductive path is thereby completed from the contact pad 425 on thetopside surface 444 of the substrate 416, through the TSV conductor 450,to the backside surface 446 of the substrate 416. The metal layer isthen etched back so that it only partially fills via 460, as shown inthe figure. A patterned photoresist mask is used to protect the metal invia 462 from this etch-back. An additional dielectric or passivationlayer (not shown) is then formed in the via 460 to protect the metal 466and to insulate it from contact with any other conductor on the chip 412or on the below-adjacent chip 414. Referring to FIG. 5I, a metallizationlayer is then formed on the backside of dielectric layer 458 andpatterned to form the RDL conductors 464. The metal used for the RDLconductors again may be the same as that used to fill the TSVs 540 and542. As shown in FIG. 41 the RDL conductors connect to TSV conductor 451(through via 462) but do not connect to (remain insulated from) TSVconductor 450. Additional RDL levels (not shown) may also be formed onthe backside of the substrate 416 in various embodiments. Thebelow-adjacent chip 414 is then attached as illustrated in FIG. 4.

Note that alternative embodiments exist in which some or all of thechips in a three-dimensional chip stack do not use RDL conductors atall. Such embodiments can still include TSV conductors like 450 solelyfor the purpose of the back-tie to the substrate 416 backside asdescribed herein.

Overall Design Process Flow

FIG. 6 shows a simplified representation of an illustrative digitalintegrated circuit design flow, applicable for each of the chips 412 and414 in the 3DIC. At a high level, the process starts with the productidea (step 600) and is realized in an EDA (Electronic Design Automation)software design process (step 610). When the design is finalized, it canbe taped-out (step 627). At some point after tape out, the fabricationprocess (step 650) and packaging and assembly processes (step 660) occurresulting, ultimately, in finished integrated circuit chips (result670).

The EDA software design process (step 610) is itself composed of anumber of steps 612-630, shown in linear fashion for simplicity. In anactual integrated circuit design process, the particular design mighthave to go back through steps until certain tests are passed. Similarly,in any actual design process, these steps may occur in different ordersand combinations. This description is therefore provided by way ofcontext and general explanation rather than as a specific, orrecommended, design flow for a particular integrated circuit.

A brief description of the component steps of the EDA software designprocess (step 610) will now be provided.

System design (step 612): The designers describe the functionality thatthey want to implement, they can perform what-if planning to refinefunctionality, check costs, etc. Hardware-software architecturepartitioning can occur at this stage. Example EDA software products fromSynopsys, Inc. that can be used at this step include Model Architect,Saber, System Studio, and DesignWare® products.

Logic design and functional verification (step 614): At this stage, theVHDL or Verilog code for modules in the system is written and the designis checked for functional accuracy. More specifically, the design ischecked to ensure that it produces correct outputs in response toparticular input stimuli. Example EDA software products from Synopsys,Inc. that can be used at this step include VCS, VERA, DesignWare®,Magellan, Formality, ESP and LEDA products.

Synthesis and design for test (step 616): Here, the VHDL/Verilog istranslated to a netlist. The netlist can be optimized for the targettechnology. Additionally, the design and implementation of tests topermit checking of the finished chip occurs. Example EDA softwareproducts from Synopsys, Inc. that can be used at this step includeDesign Compiler®, Physical Compiler, DFT Compiler, Power Compiler, FPGACompiler, TetraMAX, and DesignWare® products.

Netlist verification (step 618): At this step, the netlist is checkedfor compliance with timing constraints and for correspondence with theVHDL/Verilog source code. Example EDA software products from Synopsys,Inc. that can be used at this step include Formality, PrimeTime, and VCSproducts.

Design planning (step 620): Here, an overall floor plan for the chip isconstructed and analyzed for timing and top-level routing. Example EDAsoftware products from Synopsys, Inc. that can be used at this stepinclude Astro and Custom Designer products.

Physical implementation (step 622): The placement (positioning ofcircuit elements) and routing (connection of the same) occurs at thisstep, as can selection of library cells to perform specified logicfunctions. Example EDA software products from Synopsys, Inc. that can beused at this step include the Astro, IC Compiler, and Custom Designerproducts. The TSVs such as 450 can be defined in this step or in step620 in various embodiments.

Analysis and extraction (step 624): At this step, the circuit functionis verified at a transistor level, this in turn permits what-ifrefinement. Example EDA software products from Synopsys, Inc. that canbe used at this step include AstroRail, PrimeRail, PrimeTime, andStar-RCXT products.

Physical verification (step 626): At this step various checkingfunctions are performed to ensure correctness for: manufacturing,electrical issues, lithographic issues, and circuitry. Example EDAsoftware products from Synopsys, Inc. that can be used at this stepinclude the Hercules product.

Tape-out (step 627): This step provides the “tape-out” data to be used(after lithographic enhancements are applied if appropriate) forproduction of masks for lithographic use to produce finished chips.Example EDA software products from Synopsys, Inc. that can be used atthis step include the IC Compiler and Custom Designer families ofproducts.

Resolution enhancement (step 628): This step involves geometricmanipulations of the layout to improve manufacturability of the design.Example EDA software products from Synopsys, Inc. that can be used atthis step include Proteus, ProteusAF, and PSMGen products.

Mask data preparation (step 630): This step provides mask-making-ready“tape-out” data for production of masks for lithographic use to producefinished chips. Example EDA software products from Synopsys, Inc. thatcan be used at this step include the CATS(R) family of products.

In the layout process performed in steps 620 and 622, the locations ofall the TSVs typically are defined before other cells are placed. TSVs540 in one embodiment are placed in a regular pattern across the chip.In another embodiment, TSVs 540 are placed close to the N+ and P+regions of I/O areas, rather than those of core areas. In either casethe placement may be performed automatically by a computer system underthe control of place-and-route software.

The layout defines a number of masks for the fabrication process. Amongthese masks is a TSV layer mask, which identifies the lateral size,shape and position of each of the TSVs. This mask is used to pattern aphotoresist on the substrate topside surface, with openings throughwhich the TSV trenches will be etched. The layout also defines severalmetal layer masks, each used to pattern a respective one of the metalinterconnect layers. It is in the layout for one of these masks that aninterconnect is defined for electrically connecting the topside end ofTSV conductor 450 to the heavily doped P+ contact pad 425. The layoutalso defines a mask to pattern the vias 460 and 462 in the backsidedielectric 458. It is in the layout for this mask that the via 460 isdefined such that it is either wider or laterally offset from the centerof the backside end of TSV 540, or both, so that it exposes both thebackside end of TSV conductor 450 and the region 467 on the backsidesurface 446 of the substrate 416. The layout also defines a mask topattern a photoresist for etching back the metal 446 deposited in via460 while protecting the metal in via 462 from this etch-back.

Thus among other things, the layout identifies mask features (e.g. thelocations of the photoresist openings) for etching a TSV 540 which,after electroplating and thinning, will form a TSV conductor 450extending entirely through the chip. It also identifies mask features(e.g. the location of interconnect 456) for forming a conductive pathelectrically connecting the topside end of the TSV conductor 450 to P+contact pad 425 on topside surface of the chip, as well as mask features(e.g. the size, shape and position of via 460 in the backside dielectric458) for electrically interconnecting the backside end of the TSVconductor 450 to region 467 on the backside surface 446 of the chip. Thelayout of course also defines many other masks for fabrication of thechip 412.

Computer System

FIG. 7 is a simplified block diagram of a computer system 710 that canbe used to implement software incorporating aspects of the presentinvention. In particular, the layout process described above isimplemented using such a computer system, under control of layoutsoftware. The software implementing the layout process and the otherprocess steps identified in FIG. 6 causes the computer system 710 tooperate in the specified manner.

Computer system 710 typically includes a processor subsystem 714 whichcommunicates with a number of peripheral devices via bus subsystem 712.These peripheral devices may include a storage subsystem 724, comprisinga memory subsystem 726 and a file storage subsystem 728, user interfaceinput devices 722, user interface output devices 720, and a networkinterface subsystem 716. The input and output devices allow userinteraction with computer system 710. Network interface subsystem 716provides an interface to outside networks, including an interface tocommunication network 718, and is coupled via communication network 718to corresponding interface devices in other computer systems.Communication network 718 may comprise many interconnected computersystems and communication links. These communication links may bewireline links, optical links, wireless links, or any other mechanismsfor communication of information, but typically it is an IP-basedcommunication network. While in one embodiment, communication network718 is the Internet, in other embodiments, communication network 718 maybe any suitable computer network.

The physical hardware component of network interfaces are sometimesreferred to as network interface cards (NICs), although they need not bein the form of cards: for instance they could be in the form ofintegrated circuits (ICs) and connectors fitted directly onto amotherboard, or in the form of macrocells fabricated on a singleintegrated circuit chip with other components of the computer system.

User interface input devices 722 may include a keyboard, pointingdevices such as a mouse, trackball, touchpad, or graphics tablet, ascanner, a touch screen incorporated into the display, audio inputdevices such as voice recognition systems, microphones, and other typesof input devices. In general, use of the term “input device” is intendedto include all possible types of devices and ways to input informationinto computer system 710 or onto computer network 718.

User interface output devices 720 may include a display subsystem, aprinter, a fax machine, or non visual displays such as audio outputdevices. The display subsystem may include a cathode ray tube (CRT), aflat panel device such as a liquid crystal display (LCD), a projectiondevice, or some other mechanism for creating a visible image. Thedisplay subsystem may also provide non visual display such as via audiooutput devices. In general, use of the term “output device” is intendedto include all possible types of devices and ways to output informationfrom computer system 710 to the user or to another machine or computersystem.

Storage subsystem 724 stores the basic programming and data constructsthat provide the functionality of certain embodiments of the presentinvention. For example, the various modules implementing thefunctionality of certain embodiments of the invention may be stored instorage subsystem 724. These software modules are generally executed byprocessor subsystem 714.

Memory subsystem 726 typically includes a number of memories including amain random access memory (RAM) 730 for storage of instructions and dataduring program execution and a read only memory (ROM) 732 in which fixedinstructions are stored. File storage subsystem 728 provides persistentstorage for program and data files, and may include a hard disk drive, afloppy disk drive along with associated removable media, a CD ROM drive,an optical drive, or removable media cartridges. The databases andmodules implementing the functionality of certain embodiments of theinvention may have been provided on a computer readable medium such asone or more CD-ROMs, and may be stored by file storage subsystem 728.The host memory 726 contains, among other things, computer instructionswhich, when executed by the processor subsystem 714, cause the computersystem to operate or perform functions as described herein. As usedherein, processes and software that are said to run in or on “the host”or “the computer”, execute on the processor subsystem 714 in response tocomputer instructions and data in the host memory subsystem 726including any other local or remote storage for such instructions anddata.

Bus subsystem 712 provides a mechanism for letting the variouscomponents and subsystems of computer system 710 communicate with eachother as intended. Although bus subsystem 712 is shown schematically asa single bus, alternative embodiments of the bus subsystem may usemultiple busses.

Computer system 710 itself can be of varying types including a personalcomputer, a portable computer, a workstation, a computer terminal, anetwork computer, a television, a mainframe, a server farm, or any otherdata processing system or user device. Due to the ever changing natureof computers and networks, the description of computer system 710depicted in FIG. 7 is intended only as a specific example for purposesof illustrating the preferred embodiments of the present invention. Manyother configurations of computer system 710 are possible having more orless components than the computer system depicted in FIG. 7.

As used herein, the “identification” of an item of information does notnecessarily require the direct specification of that item ofinformation. Information can be “identified” in a field by simplyreferring to the actual information through one or more layers ofindirection, or by identifying one or more items of differentinformation which are together sufficient to determine the actual itemof information. In addition, the term “indicate” is used herein to meanthe same as “identify”.

The following references are incorporated herein for their teachings:U.S. Patent Pre-grant Publication Nos. 2010-0244179 and 2011-0195546,and U.S. Pat. Nos. 5,428,247, 7,262,109, 7,691,748 and 7,956,442.

The applicant hereby discloses in isolation each individual featuredescribed herein and any combination of two or more such features, tothe extent that such features or combinations are capable of beingcarried out based on the present specification as a whole in light ofthe common general knowledge of a person skilled in the art,irrespective of whether such features or combinations of features solveany problems disclosed herein, and without limitation to the scope ofthe claims. The applicant indicates that aspects of the presentinvention may consist of any such feature or combination of features. Inview of the foregoing description it will be evident to a person skilledin the art that various modifications may be made within the scope ofthe invention.

The foregoing description of preferred embodiments of the presentinvention has been provided for the purposes of illustration anddescription. It is not intended to be exhaustive or to limit theinvention to the precise forms disclosed. Obviously, many modificationsand variations will be apparent to practitioners skilled in this art.For example, whereas “TSV early” processing is described above withrespect to FIG. 5, other embodiments can use other variants such as “TSVfirst” processing. Also, in some embodiments, the contact to thebackside surface can be connected for example to the ground of thebelow-adjacent chip through an RDL routing conductor. In particular, andwithout limitation, any and all variations described, suggested orincorporated by reference in this patent application are specificallyincorporated by reference into the description herein of embodiments ofthe invention. In addition, any and all variations described, suggestedor incorporated by reference herein with respect to any one embodimentare also to be considered taught with respect to all other embodiments.The embodiments described herein were chosen and described in order tobest explain the principles of the invention and its practicalapplication, thereby enabling others skilled in the art to understandthe invention for various embodiments and with various modifications asare suited to the particular use contemplated. It is intended that thescope of the invention be defined by the following claims and theirequivalents.

What is claimed is:
 1. An integrated circuit device comprising: a firstsemiconductor substrate having opposite topside and backside surfaces;and a first conductor extending entirely through the first substrate,the first conductor being electrically connected on a first end to afirst point on the first substrate topside surface and on a second endto a second point on the first substrate backside surface.
 2. A deviceaccording to claim 1, wherein the first substrate comprises a p-typelightly doped substrate and a p-type heavily doped contact pad at thefirst substrate topside surface, wherein the first point is on thep-type heavily doped contact pad.
 3. A device according to claim 1,further comprising: an insulating layer on the backside surface of thefirst substrate, the insulating layer having an opening which exposesboth the second end of the first conductor and a particular region ofthe first substrate on the backside thereof; and a conductive materialin the opening electrically connecting the second end of the firstconductor with the particular region.
 4. A device according to claim 1,further comprising: an additional TSV passing through the firstsubstrate; an insulating layer on the backside surface of the firstsubstrate; and a plurality of RDL conductors on the backside of theinsulating layer, wherein the additional TSV is electrically connectedto one of the RDL conductors through a via in the insulating layer, andthe first conductor is not connected to any RDL conductors on thebackside of the first substrate.
 5. A device according to claim 1,further comprising: an additional TSV passing through the firstsubstrate; and an additional integrated circuit chip located on thebackside of the insulating layer, wherein the additional TSV iselectrically connected to a conductor on the additional integratedcircuit chip; and the first conductor is insulated from all conductorson the additional integrated circuit chip.
 6. A device according toclaim 1, wherein the first conductor is insulated along its entirelength from the first substrate.
 7. An integrated circuit devicecomprising: a first semiconductor substrate having opposite topside andbackside surfaces; a first conductor extending entirely through thefirst substrate, the first conductor being electrically connected on afirst end to a first point on the first substrate topside surface; aplurality of RDL conductors on the backside of the first substrate,wherein the first conductor is insulated from all RDL conductors on thebackside of the first substrate.
 8. A device according to claim 7,further comprising: an additional TSV passing through the firstsubstrate, wherein the additional TSV is electrically connected to oneof the RDL conductors.
 9. An integrated circuit device comprising: afirst semiconductor substrate having opposite topside and backsidesurfaces; a first conductor extending entirely through the firstsubstrate, the first conductor being electrically connected on a firstend to a first point on the first substrate topside surface; and anadditional integrated circuit chip located on the backside of the firstsubstrate, wherein the first conductor is insulated from all conductorson the additional substrate.
 10. A device according to claim 9, furthercomprising: an additional TSV passing through the first substrate,wherein the additional TSV is electrically connected to a conductor onthe additional integrated circuit chip.
 11. A three-dimensionalintegrated circuit comprising: a plurality of integrated circuit chipsstacked vertically in a fixed structure, the plurality of chipsincluding a first chip having opposite topside and backside surfaces;and a first conductor extending entirely through the first chip, thefirst conductor being electrically connected on a first end to a firstpoint on the first chip topside surface and on a second end to a secondpoint on the first chip backside surface.
 12. A three-dimensionalintegrated circuit according to claim 11, wherein the first chip has noRDL conductors on the backside of the first chip.
 13. Athree-dimensional integrated circuit comprising: a plurality ofintegrated circuit chips stacked vertically in a fixed structure, theplurality of chips including a first chip having opposite topside andbackside surfaces; a first conductor extending entirely through thefirst chip, the first conductor being electrically connected on a firstend to a first point on the first chip topside surface; and a pluralityof RDL conductors on the backside of the first chip; wherein the firstconductor is insulated from all RDL conductors on the backside of thefirst chip.
 14. A three-dimensional integrated circuit comprising: aplurality of integrated circuit chips stacked vertically in a fixedstructure, the plurality of chips including a first chip having oppositetopside and backside surfaces and an additional chip stacked adjacent tothe backside of the first chip; and a first conductor extending entirelythrough the first chip, the first conductor being electrically connectedon a first end to a first point on the first chip topside surface,wherein the first conductor is insulated from all conductors on theadditional chip.